Dip Coating is one of the earliest coating techniques that mankind has been familiar with and today is now known as the most common commercial method for deposition of different coatings. Today, by using sol-gel, or in general, other similar methods based on chemical solution, efficient and durable coatings of a wide range of materials such as ferroelectrics, dielectrics, photoresists, superconductors, polymers (especially for fabrication of membranes), and corrosion and oxidation resistant materials can be applied onto different substrates.
Milling is one of the common methods in preparing powders. This method can also be utilized for mechanical alloying. The used tools in this method are usually ball mills.
Some of the methods which are used today to deposit materials onto a substrate are stemmed from the welding processes. Electro Spark Deposition (ESD) is one of the coating processes which many of its features are similar to the welding processes. Indeed, ESD is a micro-welding manufacturing process commonly used to repair mechanical components such as injection molds.
Plasma is the fourth state of matter after solid, liquid, and gas states. However, this definition may be slightly confusing. More precisely, the plasma can be defined as a gas which is fully or partially ionized. According to this definition, plasma is a gaseous medium consisting of molecules, atoms, ions, and electrons. Due to the presence of charged particles, plasma has an electrical conductivity and is also strongly influenced by electric and magnetic fields.
Plasma is the fourth state of matter after solid, liquid, and gas states. However, this definition may be slightly confusing. More precisely, the plasma can be defined as a gas which is fully or partially ionized. According to this definition, plasma is a gaseous medium consisting of molecules, atoms, ions, and electrons.
Pulsed-Laser Deposition (PLD) is a type of physical vapor deposition which uses thermal stimulation for evaporation, transfer, and deposition of Target atoms onto a substrate. Like all similar deposition methods, the main sections of this apparatus are Target (desired coating material) and a substrate, which are placed in a chamber connected to the vacuum pumps; during deposition process, a laser beam is employed to thermally stimulate the Target.
Sputtering is a kind of non-thermal vaporization which is extensively being used for producing conductive and non-conductive thin film coating on various substrates.
Milling is one of the most widely used methods for preparing different powders in different dimensions. Furthermore, this technique can be used for mechanical alloying.
Physical Vapor Deposition (PVD) is the name of large family of vacuum-based layer deposition methods which today is being extensively used for production of thin films and coatings.
Sputtering is one of the vacuum-based techniques used to deposit thin film coatings. This technique involves three basic steps including; the momentum transfer from high energetic ions of ionized gas to a cathode (Target), the ejection of atoms from the Target, and then the deposition onto a substrate (anode).
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