Plasma is the fourth state of matter after solid, liquid, and gas states. However, this definition may be slightly confusing. More precisely, the plasma can be defined as a gas which is fully or partially ionized. According to this definition, plasma is a gaseous medium consisting of molecules, atoms, ions, and electrons. Due to the presence of charged particles, plasma has an electrical conductivity and is also strongly influenced by electric and magnetic fields.
Plasma is the fourth state of matter after solid, liquid, and gas states. However, this definition may be slightly confusing. More precisely, the plasma can be defined as a gas which is fully or partially ionized. According to this definition, plasma is a gaseous medium consisting of molecules, atoms, ions, and electrons.
Pulsed-Laser Deposition (PLD) is a type of physical vapor deposition which uses thermal stimulation for evaporation, transfer, and deposition of Target atoms onto a substrate. Like all similar deposition methods, the main sections of this apparatus are Target (desired coating material) and a substrate, which are placed in a chamber connected to the vacuum pumps; during deposition process, a laser beam is employed to thermally stimulate the Target.
Sputtering is a kind of non-thermal vaporization which is extensively being used for producing conductive and non-conductive thin film coating on various substrates.
Milling is one of the most widely used methods for preparing different powders in different dimensions. Furthermore, this technique can be used for mechanical alloying.
Physical Vapor Deposition (PVD) is the name of large family of vacuum-based layer deposition methods which today is being extensively used for production of thin films and coatings.
Sputtering is one of the vacuum-based techniques used to deposit thin film coatings. This technique involves three basic steps including; the momentum transfer from high energetic ions of ionized gas to a cathode (Target), the ejection of atoms from the Target, and then the deposition onto a substrate (anode).
Plasma is an ionized gas in which whole or a significant portion of its atoms have lost one or several electrons, and turned into positive ions. In recent decades, plasma technology has been used for some applications such as surface modification and cleaning. Plasma cleaning is a process in which all organic compounds are removed from the surface by using plasma.
Plasma Enhanced Chemical Vapour Deposition (PECVD) is a process in which thin films of different materials are deposited on a substrate surface at low temperatures. Since plasma can reduce the activation energy of a reaction, the deposition temperature can be significantly decreased.
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